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BESIYBE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESIY) Stock Price: $321.34-6.67 (-2.03%)

At close: Jun 26, 2026, 4:00 PM ET

The closing share price for BE Semiconductor Industries N.V. (BESIY) stock was $321.34 for Friday, June 26, 2026, down 2.03% on the day.

Longer view (total return, dividends reinvested): past 12 months +115.3% · 3-year avg +47.1%/yr · 5-year avg +34.6%/yr

BESIY Price Chart

End-of-day pricesAdvanced chart →
BESIY$321.34 120.66%(1Y)as of Jun 26, 2026

Price CAGR

Total Return CAGR

Revenue CAGR

Net Income CAGR

EPS CAGR

Dividends CAGR

BESIY Earnings Preview

Next Earnings Date

Jul 23, 2026

26 days away

EPS Estimate

1.24

Revenue Est.

$281.00M

Last Quarter Results

EPS

$0.76

vs Estimate

$0.74

Beat

Revenue

$216.51M

vs Estimate

$218.38M

Met

BESIY Analyst Ratings

Consensus Rating

N/A

No analyst recommendations available

Strong Buy
0
Buy
0
Hold
0
Sell
0
Strong Sell
0

Average Price Target

N/A

Low

N/A

Current

$321.34

High

N/A

BESIY Analyst Estimates

Forward P/E: 49.52

Earnings Per Share (EPS) Estimates

Quarterly

PeriodAvg# Analysts
Q1 2026$0.661
Q2 2026$1.081
Q3 2026$1.081
Q4 2026$1.161

Annual

PeriodAvg# Analysts
FY 2027$6.491
FY 2028$8.561

Revenue Estimates

Quarterly

PeriodAvg# Analysts
Q1 2026$189.73M11
Q2 2026$246.72M4
Q3 2026$247.09M4
Q4 2026$257.53M3

Annual

PeriodAvg# Analysts
FY 2027$1.34B11
FY 2028$1.67B4

Source: FMP Analyst Consensus Estimates. Forward P/E uses the next-fiscal-year consensus EPS estimate (the same value shown in the Key Metrics strip).

BESIY Competitors' Key Metrics

StockMarket CapTTM Total ReturnCompare
1BESIY$25.45B+115.29%
2ZM$25.36B+12.38%vs BESIY
3MDB$25.26B+50.14%vs BESIY
4MKSI$26.09B+287.23%vs BESIY
5ENTG$24.59B+93.81%vs BESIY
6FISV$26.37B-71.17%vs BESIY

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman