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BESIYBE Semiconductor Industries N.V.

Debt to Assets Ratio: 43.30%

Is the debt to assets ratio high or low?

The debt to assets ratio of 43.30% is 19% above its 5-year average of 36.24%, near the high end of its 5-year range (24.31%–50.64%).

As of Saturday, June 27, 2026. 7.98% below its 12-month average of 47.05%.

Debt to Assets

BESIY Debt to Assets Ratio

43.30%

Reported quarterly debt to assets ratio; no daily interpolation.

+35.44% 5Y
BESIY Debt to Assets Ratio

BESIY Average Debt to Assets Ratio Chart

BESIY Debt to Assets Ratio

BESIY Current vs Average Debt to Assets Ratio Chart

BESIY Debt to Assets Ratio Metrics

DEBT TO ASSETS RATIO

43.30%

DEBT TO ASSETS RATIO AVG TTM

47.05%

DEBT TO ASSETS RATIO AVG 3Y

40.10%

DEBT TO ASSETS RATIO AVG 5Y

36.24%

DEBT TO ASSETS RATIO AVG 10Y

35.61%

DEBT TO ASSETS RATIO AVG 15Y

24.48%

DEBT TO ASSETS RATIO AVG 20Y

23.85%

CURRENT VS TTM AVG

-7.98%

CURRENT VS 3Y AVG

+7.96%

CURRENT VS 5Y AVG

+19.48%

CURRENT VS 10Y AVG

+21.60%

CURRENT VS 15Y AVG

+76.87%

CURRENT VS 20Y AVG

+81.53%

BESIY Competitors' Debt to Assets Ratio

NAMEMARKET CAPDEBT TO ASSETS RATIOTTM3Y5Y
BE Semiconductor Industries N.V. (BESIY)$25.45B43.30%47.05%40.10%36.24%
Zoom Communications, Inc. (ZM)vs ›$25.36B0.00%N/AN/AN/A
MongoDB, Inc. (MDB)vs ›$25.26B0.01%N/AN/AN/A
MKS Inc. (MKSI)vs ›$26.09B0.53%N/AN/AN/A
Entegris, Inc. (ENTG)vs ›$24.59B0.47%N/AN/AN/A
Fiserv, Inc. (FISV)vs ›$26.37B0.36%N/AN/AN/A
Splunk Inc. (SPLK)vs ›$26.44B0.49%N/AN/AN/A
Strategy Inc (MSTR)vs ›$24.45B0.13%N/AN/AN/A
Verisk Analytics, Inc. (VRSK)vs ›$23.87B0.81%N/AN/AN/A
Fair Isaac Corporation (FICO)vs ›$27.43B1.65%N/AN/AN/A

Leverage Ratios Comparison

Debt/Assets

43.3%

Debt/Equity

1.25

Current Ratio

5.55

Interest Coverage

9.1x

Formula: Debt/Assets = Total Debt / Total Assets × 100

Debt/Assets vs Debt/Equity:

  • Debt/Assets: Shows % of assets funded by creditors (bounded 0-100%)
  • Debt/Equity: Shows debt relative to shareholder investment (can exceed 100%)
  • Both measure leverage but from different perspectives

Industry context matters: Capital-intensive industries (utilities, real estate) typically have higher Debt/Assets ratios than tech companies.

Debt to Assets Ratio Formula & Definition

Debt/Assets ratio shows what percentage of a company's assets are financed by debt. Compare the current value with the historical chart and peer group to understand leverage over time.

Expanded definitions: Investopedia, Wikipedia, Corporate Finance Institute

Debt to Assets Ratio FAQ

What is the debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The debt to assets ratio for BESIY stock is 43.30%.
Is BE Semiconductor Industries N.V.'s debt to assets ratio high or low?
The debt to assets ratio of 43.30% is 19% above its 5-year average of 36.24%, near the high end of its 5-year range (24.31%–50.64%).
What is the TTM average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The TTM average debt to assets ratio for BESIY stock is 47.05%.
What is the 3Y average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The 3Y average debt to assets ratio for BESIY stock is 40.10%.
What is the 5Y average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The 5Y average debt to assets ratio for BESIY stock is 36.24%.
What is the 10Y average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The 10Y average debt to assets ratio for BESIY stock is 35.61%.
What is the 15Y average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The 15Y average debt to assets ratio for BESIY stock is 24.48%.
What is the 20Y average debt to assets ratio for BE Semiconductor Industries N.V. (BESIY)?
The 20Y average debt to assets ratio for BESIY stock is 23.85%.

BESIY Debt to Assets Ratio History

DATEDEBT TO ASSETS RATIO
2026-03-3143.30%
2025-12-3147.55%
2025-09-3050.33%
2025-06-3050.64%
2025-03-3143.43%
2024-12-3144.12%
2024-09-3046.29%
2024-06-3025.76%
2024-03-3129.82%
2023-12-3135.60%
2023-09-3037.17%
2023-06-3037.38%
2023-03-3129.94%
2022-12-3130.21%
2022-09-3028.12%
2022-06-3028.82%
2022-03-3124.31%
2021-12-3127.31%
2021-09-3028.97%
2021-06-3031.97%
2021-03-3139.96%
2020-12-3144.98%
2020-09-3047.60%
2020-06-3040.43%
2020-03-3139.46%
2019-12-3141.50%
2019-09-3042.63%
2019-06-3043.58%
2019-03-3136.21%
2018-12-3135.74%
2018-09-3036.13%
2018-06-3036.22%
2018-03-3129.96%
2017-12-3132.03%
2017-09-3019.79%
2017-06-3021.27%
2017-03-3121.29%
2016-12-3123.27%
2016-09-304.82%
2016-06-304.87%
2016-03-314.71%
2015-12-314.93%
2015-09-305.55%
2015-06-305.06%
2015-03-315.56%
2014-12-313.91%
2014-09-304.48%
2014-06-305.22%
2014-03-315.18%
2013-12-315.47%
2013-09-306.46%
2013-06-306.79%
2013-03-317.33%
2012-12-317.39%
2012-09-308.18%
2012-06-307.41%
2012-03-316.56%
2011-12-316.81%
2011-09-307.21%
2011-06-303.95%
2011-03-3112.36%
2010-12-3112.39%
2010-09-3014.47%
2010-06-3014.50%
2010-03-3115.48%
2009-12-3118.17%
2006-12-3119.39%
2006-09-3027.18%
2006-06-3026.97%
2006-03-3127.74%
2005-12-3127.50%
2005-09-3028.03%
2005-06-3028.12%
2005-03-3128.11%
2004-12-316.21%
2004-09-306.21%
2004-06-306.40%
2004-03-316.31%
2003-12-314.01%
2003-09-304.01%
2003-06-303.59%
2003-03-313.54%
2002-12-313.69%
2002-09-303.62%
2002-06-303.76%
2002-03-314.40%
2001-12-313.93%
2001-09-303.77%
2001-06-303.69%
2001-03-313.57%
2000-12-313.80%
2000-09-304.02%
2000-06-304.25%
2000-03-3110.10%
1999-12-3110.45%
1999-09-3013.99%

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman