Price History:113.87%(TTM)
Over the latest trailing 12-month period, price cagr is +113.87%. The comparable SPY value is +19.16%. Year-to-date price return is +84.00%. Price CAGR uses adjusted close price history and excludes dividends.
Current Price
$321.34
$-6.67 (-2.03%)
Previous Close: $328.01
Last Session
- Open
- $320.00
- Day High
- $326.10
- Day Low
- $320.00
- Volume
- 6.71K
- Avg Volume
- 8.54K
52-Week Position
79%
of the 52-week price range
- From 52-week high
- -14.16%
- From 52-week low
- +161.66%
52-Week Price Range
52-Week Low
$122.81
Sep 3, 2025
Current Price
$321.34
79% of range
52-Week High
$374.33
Jun 22, 2026
Price Returns by Period
1 Day
-2.03%
7 Days
-12.31%
30 Days
-3.70%
YTD
+84.00%
1 Year
+113.76%
vs 52W High
-14.16%
BESIY Price Chart
Long-Term Performance (CAGR)
Price CAGR (3Y)
+44.85%
Price CAGR (5Y)
+30.95%
Total Return CAGR (3Y)
+47.06%
Total Return CAGR (5Y)
+34.62%
CAGR (Compound Annual Growth Rate) shows the annualized return over the specified period. Total Return includes dividends reinvested.
Key Price Statistics
| Current Price | $321.34 |
| Previous Close | $328.01 |
| Day Range | $320.00 - $326.10 |
| 52-Week Range | $122.81 - $374.33 |
| Volume | 6.71K |
| Average Volume | 8.54K |
| Market Cap | $25.45B |
| % from 52W High | -14.16% |
Related Metrics
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman