BE Semiconductor Industries N.V. (BESIY) DCF Valuation
Why we don't show a single “fair value” for BESIY
Even the optimistic scenario of a conservative trailing-FCF model ($42.76) sits far below today's price — the market is paying for growth and durability beyond what this model structure captures. Off today's cash-flow base, no plausible growth rate bridges to the current price — the market is valuing normalized future cash flows, not the depressed base. The model scenarios below are shown for reference only.
| Scenario | FCF growth (fading to 2.5%) | Discount | Value / share |
|---|---|---|---|
| Conservative | 3.7%/yr | 11.9% | $25.59 |
| Base case | 6.7%/yr | 10.9% | $32.82 |
| Optimistic | 9.7%/yr | 9.9% | $42.76 |
Current Price
$321.34
Market-Implied Growth
—
Base-Case Model Value
$32.82
model output — not a price target
BESIY DCF Fair Value Calculator
Edit the assumptions to see how they change the estimated fair value. Opens seeded with TGM's data-driven base case for BESIY (growth from its own 5-year record, discount from its beta), so the sandbox starts where the scenarios above leave off. Illustrative model — not investment advice.
Base inputs: FCF $191.2M · 0.08B shares · net debt $161.0M
Estimated Fair Value
$37.64
-88.3% vs $321.34
Sensitivity — fair value by discount rate × terminal growth
How the estimated fair value shifts with the discount rate (WACC) and terminal growth, holding your 6.7%/yr FCF growth and 10-year horizon fixed. Green = above today's $321.34; red = below. Your current case is outlined.
| WACC ↓ / Terminal → | 1.50% | 2.00% | 2.50% | 3.00% | 3.50% |
|---|---|---|---|---|---|
| 8.9% | $46.59 | $48.69 | $51.12 | $53.95 | $57.32 |
| 9.9% | $40.27 | $41.76 | $43.45 | $45.39 | $47.62 |
| 10.9% | $35.33 | $36.42 | $37.64 | $39.01 | $40.57 |
| 11.9% | $31.37 | $32.18 | $33.09 | $34.09 | $35.21 |
| 12.9% | $28.12 | $28.74 | $29.43 | $30.18 | $31.01 |
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman