Dividends
Dividend payments are $1.85 per share, with a current dividend yield of 0.57%. The company has dividend history for 1 consecutive years.
BESIY Dividend Summary
0.57%
$1.85
82.78%
61.37%
Consecutive Years
1
Most Recent Ex-Date
Apr 28, 2026
Most Recent Payment
May 14, 2026
BESIY Dividends per Share (Nominal History)
View full nominal table listThis step chart displays the nominal dividend payouts over time on their actual payment dates, matching the distribution frequency.
BESIY Dividends CAGR Chart
BE Semiconductor Industries N.V. (BESIY)
Annual Dividend History
| Year | Dividend/Share | YoY Growth |
|---|---|---|
| 2026(YTD) | $1.85 | — |
| 2025 | $2.49 | +8.86% |
| 2024 | $2.29 | -26.64% |
| 2023 | $3.12 | -11.22% |
| 2022 | $3.51 | +70.88% |
| 2021 | $2.05 | +83.85% |
| 2020 | $1.12 | -40.54% |
| 2019 | $1.88 | -33.53% |
| 2018 | $2.83 | +198.35% |
| 2017 | $0.95 | +731.02% |
| 2016 | $0.11 | -86.22% |
| 2015 | $0.83 | +262.94% |
| 2014 | $0.23 | +16.03% |
| 2013 | $0.20 | +35.05% |
| 2012 | $0.15 | -48.50% |
| 2011 | $0.28 | N/A |
Quarterly Dividend History
| Quarter | Dividend/Share | YoY Growth |
|---|---|---|
| Q2 2026 | $1.85 | -25.75% |
| Q2 2025 | $2.49 | +8.86% |
| Q2 2024 | $2.29 | -26.64% |
| Q2 2023 | $3.12 | -11.22% |
| Q2 2022 | $3.51 | +70.88% |
| Q2 2021 | $2.05 | +83.85% |
| Q2 2020 | $1.12 | -40.54% |
| Q2 2019 | $1.88 | -33.53% |
| Q2 2018 | $2.83 | +198.35% |
| Q2 2017 | $0.95 | +731.02% |
| Q2 2016 | $0.11 | -86.22% |
| Q2 2015 | $0.83 | +262.94% |
| Q2 2014 | $0.23 | +16.03% |
| Q2 2013 | $0.20 | +35.05% |
| Q2 2012 | $0.15 | -48.50% |
| Q2 2011 | $0.28 | — |
Dividend Yield Metrics
- Current Yield
- 0.57%
- Average Yield (TTM)
- 0.57%
- Average Yield (3Y)
- 0.69%
- Forward Yield on Cost (3Y)
- 0.30%
- Forward Yield on Cost (5Y)
- 0.20%
- Forward Yield on Cost (10Y)
- 0.07%
Payout Ratio Analysis
- Payout Ratio (Current)
- 82.78%
- FCF Payout Ratio
- 61.37%
- Payout Ratio (3Y Avg)
- 118.19%
- Payout Ratio (5Y Avg)
- 102.32%
- FCF Payout (3Y Avg)
- 111.36%
- FCF Payout (5Y Avg)
- 99.23%
An FCF payout above 100% means dividends exceeded the period's free cash flow, often because of temporarily depressed FCF (one-off capex or working-capital swings) rather than an unfunded dividend. Compare against the earnings payout ratio and the multi-year trend before drawing a conclusion.
Dividend Coverage
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman