Revenue CAGR:13.77%(TTM)
Based on reported financial statement history.
Over longer horizons, Revenue CAGR averages 2.80% over 3 years and 5.43% over 5 years.The TTM figure compares the trailing 12 months (sum of the latest four quarters) with the 12 months before that. Rows in the history table compare fiscal years, and the quarterly table compares single quarters; the three measure different windows and will differ. Revenue CAGR measures how the company's top-line revenue has grown over time. Consistent revenue growth is a key indicator of business expansion and market share gains.
BESIY Revenue CAGR Chart
BE Semiconductor Industries N.V. (BESIY)
BESIY Quarterly Revenue Growth (YoY)
Revenue growth vs the same quarter one year earlier, last 20 quarters.
BESIY Revenue CAGR History
| Year | Start Revenue | End Revenue | Change | % Change | CAGR |
|---|---|---|---|---|---|
| 2025 | $629.03M | $667.16M | +$38.13M | +6.06% | +6.06% |
| 2024 | $638.92M | $629.03M | $-9.89M | -1.55% | -1.55% |
| 2023 | $773.43M | $638.92M | $-134.51M | -17.39% | -17.39% |
| 2022 | $852.96M | $773.43M | $-79.53M | -9.32% | -9.32% |
| 2021 | $529.70M | $852.96M | +$323.26M | +61.03% | +61.03% |
| 2020 | $399.73M | $529.70M | +$129.97M | +32.51% | +32.51% |
| 2019 | $601.14M | $399.73M | $-201.41M | -33.50% | -33.50% |
| 2018 | $711.63M | $601.14M | $-110.48M | -15.53% | -15.53% |
| 2017 | $394.80M | $711.63M | +$316.83M | +80.25% | +80.25% |
| 2016 | $379.35M | $394.80M | +$15.45M | +4.07% | +4.07% |
| 2015 | $458.31M | $379.35M | $-78.96M | -17.23% | -17.23% |
| 2014 | $351.25M | $458.31M | +$107.06M | +30.48% | +30.48% |
| 2013 | $360.89M | $351.25M | $-9.64M | -2.67% | -2.67% |
| 2012 | $423.67M | $360.89M | $-62.78M | -14.82% | -14.82% |
| 2011 | $470.24M | $423.67M | $-46.57M | -9.90% | -9.90% |
| 2010 | $211.96M | $470.24M | +$258.27M | +121.85% | +121.85% |
| 2009 | $208.24M | $211.96M | +$3.72M | +1.79% | +1.79% |
| 2008 | $242.93M | $208.24M | $-34.69M | -14.28% | -14.28% |
| 2007 | $252.41M | $242.93M | $-9.48M | -3.76% | -3.76% |
| 2006 | $194.32M | $252.41M | +$58.09M | +29.89% | +29.89% |
| 2005 | $170.84M | $194.32M | +$23.48M | +13.75% | +13.75% |
| 2004 | $107.49M | $170.84M | +$63.35M | +58.93% | +58.93% |
| 2003 | $87.47M | $107.49M | +$20.02M | +22.89% | +22.89% |
| 2002 | $134.23M | $87.47M | $-46.76M | -34.84% | -34.84% |
| 2001 | $186.45M | $134.23M | $-52.23M | -28.01% | -28.01% |
| 2000 | $106.51M | $186.45M | +$79.94M | +75.06% | +75.06% |
| 1999 | $176.14M | $106.51M | $-69.63M | -39.53% | -39.53% |
| 1998 | $205.17M | $176.14M | $-29.03M | -14.15% | -14.15% |
| 1997 | $283.26M | $205.17M | $-78.10M | -27.57% | -27.57% |
Quarterly Revenue: QoQ & YoY
| Quarter | Value | QoQ | YoY |
|---|---|---|---|
| Q1 2026 | $217.11M | +12.2% | +39.3% |
| Q4 2025 | $193.57M | +24.6% | +21.8% |
| Q3 2025 | $155.38M | -11.0% | -10.9% |
| Q2 2025 | $174.56M | +12.0% | +7.8% |
| Q1 2025 | $155.89M | -1.9% | -1.3% |
| Q4 2024 | $158.86M | -8.9% | -9.8% |
| Q3 2024 | $174.33M | +7.7% | +33.7% |
| Q2 2024 | $161.92M | +2.6% | -8.7% |
| Q1 2024 | $157.86M | -10.4% | +9.1% |
| Q4 2023 | $176.20M | +35.1% | +19.6% |
| Q3 2023 | $130.40M | -26.4% | -21.2% |
| Q2 2023 | $177.28M | +22.6% | -21.0% |
| Q1 2023 | $144.64M | -1.8% | -35.4% |
| Q4 2022 | $147.35M | -10.9% | -24.6% |
| Q3 2022 | $165.42M | -26.3% | -31.4% |
| Q2 2022 | $224.31M | +0.1% | -16.3% |
QoQ = change vs the prior quarter; YoY = change vs the same quarter a year earlier.
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman