Total Return:115.29%(TTM)
Over the latest trailing 12-month period, total return cagr is +115.29%. The comparable SPY value is +20.46%. Year-to-date total return is +106.35%. Total return includes price appreciation and reinvested dividends.
Growth of $10,000 in BESIY
$812,779
(81.3x return)
Invested on Jun 27, 1996
Growth of $10,000 in SPY (S&P 500)
$182,810
(18.3x return)
Invested on Jun 27, 1996
Hypothetical Growth of $10,000
This chart illustrates the cumulative performance of a hypothetical $10,000 investment. It assumes that all dividends paid by both the stock and SPY are reinvested in additional shares on the payment date, showing the true long-term compounding impact of distributions.
Recent Performance Indicators
YTD Total Return
+106.3%
1-Year Total Return
+115.2%
Current Dividend Yield
0.57%
Price CAGR vs. Total Return CAGR
Compound Annual Growth Rate (CAGR) is shown below. The difference between price CAGR and total return CAGR is the compound contribution of dividends reinvested.
| Holding Period | Price CAGR | Total Return CAGR | Dividend Addition |
|---|---|---|---|
| 1 Year | +113.9% | +115.3% | +1.4% |
| 3 Years | +44.9% | +47.1% | +2.2% |
| 5 Years | +30.9% | +34.6% | +3.7% |
| 10 Years | +37.1% | +42.2% | +5.1% |
| 15 Years | +33.8% | +38.7% | +4.9% |
| 20 Years | +27.1% | +31.0% | +3.9% |
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman