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BESIYBE Semiconductor Industries N.V.

Selling, General & Administrative Expenses

The latest quarterly sg&a expense is $34.77 Million with a quarter-over-quarter change of +5.53%. Selling, General & Administrative (SG&A) expenses include all costs related to selling products and running the business that are not directly tied to production.

SG&A Expense

BESIY SG&A Expense

$34.77M

Reported quarterly SG&A expense; no daily interpolation.

+21.05% 5Y

Current SG&A Expense

$34.77M

$34.77 Million

Quarter-over-Quarter Change

+5.53%

vs. $32.95M prior quarter

Historical Data

96

Quarters of data available

Quarterly SG&A Expense History

PeriodSG&A ExpenseQoQ Change% Change
Q1 2026$34.77M+$1.82M+5.53%
Q4 2025$32.95M$-228,952.443-0.69%
Q3 2025$33.18M$-2.93M-8.10%
Q2 2025$36.10M+$458,701.46+1.29%
Q1 2025$35.64M+$6.05M+20.46%
Q4 2024$29.59M$-828,100.35-2.72%
Q3 2024$30.42M$-2.27M-6.93%
Q2 2024$32.68M$-10.09M-23.58%
Q1 2024$42.77M+$15.97M+59.62%
Q4 2023$26.80M+$2.15M+8.71%
Q3 2023$24.65M$-7.41M-23.12%
Q2 2023$32.06M+$636,891.71+2.03%
Q1 2023$31.42M+$7.26M+30.06%
Q4 2022$24.16M+$4.05M+20.16%
Q3 2022$20.11M$-5.68M-22.03%
Q2 2022$25.79M$-4.44M-14.68%
Q1 2022$30.23M+$7.02M+30.24%
Q4 2021$23.21M$-1.77M-7.10%
Q3 2021$24.98M$-3.74M-13.02%
Q2 2021$28.72M$-2.56M-8.18%
Q1 2021$31.28M+$11.94M+61.73%
Q4 2020$19.34M+$223,700.32+1.17%
Q3 2020$19.12M$-3.50M-15.49%
Q2 2020$22.62M$-3.32M-12.81%
Q1 2020$25.94M+$7.18M+38.28%
Q4 2019$18.76M+$1.74M+10.24%
Q3 2019$17.02M$-2.87M-14.45%
Q2 2019$19.89M$-4.43M-18.22%
Q1 2019$24.32M+$3.77M+18.34%
Q4 2018$20.55M$-3.05M-12.91%
Q3 2018$23.60M$-2.97M-11.16%
Q2 2018$26.57M$-9.46M-26.26%
Q1 2018$36.03M+$6.48M+21.91%
Q4 2017$29.55M+$4.71M+18.96%
Q3 2017$24.84M$-4.22M-14.51%
Q2 2017$29.06M+$5.39M+22.78%
Q1 2017$23.67M+$1.53M+6.91%
Q4 2016$22.14M+$471,180.68+2.17%
Q3 2016$21.67M$-132,806.24-0.61%
Q2 2016$21.80M$-1.51M-6.46%
Q1 2016$23.31M+$4.30M+22.63%
Q4 2015$19.01M$-1.79M-8.61%
Q3 2015$20.80M$-2.13M-9.31%
Q2 2015$22.93M+$4.26M+22.80%
Q1 2015$18.67M$-2.31M-11.03%
Q4 2014$20.99M+$1.38M+7.02%
Q3 2014$19.61M$-4.37M-18.23%
Q2 2014$23.98M+$2.67M+12.55%
Q1 2014$21.31M+$229,322.22+1.09%
Q4 2013$21.08M+$1.83M+9.51%
Q3 2013$19.25M+$813,611.86+4.41%
Q2 2013$18.44M+$217,080.3+1.19%
Q1 2013$18.22M$-2.13M-10.49%
Q4 2012$20.35M+$38,008.52+0.19%
Q3 2012$20.32M$-19,470.19-0.10%
Q2 2012$20.33M+$2.68M+15.17%
Q1 2012$17.66M$-5.67M-24.30%
Q4 2011$23.32M+$1.17M+5.29%
Q3 2011$22.15M$-3.49M-13.62%
Q2 2011$25.64M+$2.29M+9.79%
Q1 2011$23.36M$-4.18M-15.17%
Q4 2010$27.54M+$7.47M+37.26%
Q3 2010$20.06M+$6.25M+45.30%
Q2 2010$13.81M$-9.94M-41.86%
Q1 2010$23.75M$-2.90M-10.88%
Q4 2009$26.65M+$6.97M+35.41%
Q3 2009$19.68M+$922,913.86+4.92%
Q2 2009$18.76M+$7.27M+63.25%
Q1 2009$11.49M$-3.97M-25.68%
Q4 2006$15.46M+$2.24M+16.97%
Q3 2006$13.22M$-1.31M-8.99%
Q2 2006$14.52M+$2.42M+20.00%
Q1 2006$12.10M$-266,441.951-2.15%
Q4 2005$12.37M+$1.80M+17.00%
Q3 2005$10.57M$-1.78M-14.40%
Q2 2005$12.35M+$398,338.967+3.33%
Q1 2005$11.95M+$3.13M+35.51%
Q4 2004$8.82M$-934,761.9-9.58%
Q3 2004$9.75M+$1.80M+22.64%
Q2 2004$7.95M+$279,638.169+3.64%
Q1 2004$7.67M$-367,235.266-4.57%
Q4 2003$8.04M+$997,468.573+14.16%
Q3 2003$7.04M$-399,932.907-5.37%
Q2 2003$7.44M+$366,456.015+5.18%
Q1 2003$7.08M+$75,656.318+1.08%
Q4 2002$7.00M+$276,924.538+4.12%
Q3 2002$6.72M+$274,513.785+4.26%
Q2 2002$6.45M+$987,467.744+18.08%
Q1 2002$5.46M+$1.67M+44.00%
Q4 2001$3.79M$-3.02M-44.32%
Q3 2001$6.81M$-410,459.553-5.68%
Q2 2001$7.22M$-525,537.45-6.78%
Q1 2001$7.75M$-1.54M-16.61%
Q4 2000$9.29M+$2.01M+27.68%
Q3 2000$7.28M$-694,065.957-8.71%
Q2 2000$7.97M
Data as of Saturday, June 27, 2026

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman