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BESIYBE Semiconductor Industries N.V.

EBITDA

The latest quarterly ebitda is $86.53 Million with a quarter-over-quarter change of +12.48%. EBITDA (Earnings Before Interest, Taxes, Depreciation, and Amortization) measures a company's operating performance by removing non-cash charges and capital structure effects.

EBITDA

BESIY EBITDA

$86.53M

Reported quarterly EBITDA; no daily interpolation.

-34.19% 5Y

BESIY Quarterly EBITDA Growth (YoY)

EBITDA growth vs the same quarter one year earlier, last 20 quarters.

Current EBITDA

$86.53M

$86.53 Million

Quarter-over-Quarter Change

+12.48%

vs. $76.93M prior quarter

Historical Data

96

Quarters of data available

Quarterly EBITDA History

PeriodEBITDAQoQ Change% Change
Q1 2026$86.53M+$9.60M+12.48%
Q4 2025$76.93M+$26.42M+52.32%
Q3 2025$50.51M$-9.55M-15.89%
Q2 2025$60.05M+$9.69M+19.24%
Q1 2025$50.36M$-9.69M-16.14%
Q4 2024$60.05M$-9.47M-13.62%
Q3 2024$69.52M+$9.30M+15.44%
Q2 2024$60.23M+$8.95M+17.46%
Q1 2024$51.28M$-28.97M-36.10%
Q4 2023$80.24M+$28.50M+55.08%
Q3 2023$51.74M$-23.84M-31.54%
Q2 2023$75.59M+$23.32M+44.62%
Q1 2023$52.26M$-6.35M-10.84%
Q4 2022$58.62M$-16.97M-22.45%
Q3 2022$75.59M$-27.17M-26.44%
Q2 2022$102.76M+$6.28M+6.51%
Q1 2022$96.48M+$16.91M+21.25%
Q4 2021$79.57M$-35.83M-31.05%
Q3 2021$115.40M$-16.08M-12.23%
Q2 2021$131.48M+$69.82M+113.24%
Q1 2021$61.66M+$6.06M+10.91%
Q4 2020$55.59M+$1.14M+2.10%
Q3 2020$54.45M$-5.19M-8.70%
Q2 2020$59.64M+$33.20M+125.60%
Q1 2020$26.44M$-9.38M-26.19%
Q4 2019$35.82M+$2.93M+8.89%
Q3 2019$32.89M$-1.18M-3.47%
Q2 2019$34.08M+$12.02M+54.50%
Q1 2019$22.06M$-12.93M-36.95%
Q4 2018$34.99M$-14.19M-28.85%
Q3 2018$49.17M$-24.21M-32.99%
Q2 2018$73.38M+$9.35M+14.60%
Q1 2018$64.03M$-2.65M-3.97%
Q4 2017$66.68M$-11.84M-15.08%
Q3 2017$78.52M+$2.49M+3.27%
Q2 2017$76.03M+$39.61M+108.73%
Q1 2017$36.43M+$11.88M+48.42%
Q4 2016$24.54M$-1.30M-5.02%
Q3 2016$25.84M$-7.56M-22.63%
Q2 2016$33.40M+$18.18M+119.50%
Q1 2016$15.22M$-2.74M-15.26%
Q4 2015$17.96M+$6.59M+57.95%
Q3 2015$11.37M$-12.70M-52.77%
Q2 2015$24.07M$-2.08M-7.94%
Q1 2015$26.15M+$5.72M+27.99%
Q4 2014$20.43M$-13.27M-39.39%
Q3 2014$33.70M$-4.72M-12.27%
Q2 2014$38.42M+$24.00M+166.48%
Q1 2014$14.42M+$10.32M+251.61%
Q4 2013$4.10M$-6.06M-59.65%
Q3 2013$10.16M$-3.46M-25.39%
Q2 2013$13.62M+$4.67M+52.16%
Q1 2013$8.95M+$7.92M+771.55%
Q4 2012$1.03M$-12.28M-92.28%
Q3 2012$13.30M$-7.03M-34.58%
Q2 2012$20.34M+$13.40M+193.34%
Q1 2012$6.93M+$61,726.22+0.90%
Q4 2011$6.87M$-5.85M-45.97%
Q3 2011$12.72M$-8.68M-40.58%
Q2 2011$21.40M$-1.65M-7.15%
Q1 2011$23.05M$-4.59M-16.59%
Q4 2010$27.63M$-2.70M-8.89%
Q3 2010$30.33M+$10.46M+52.60%
Q2 2010$19.88M+$18.45M+1294.69%
Q1 2010$1.43M+$20.78M+107.36%
Q4 2009$-19.35M$-17.02M-730.24%
Q3 2009$-2.33M$-50.58M-104.83%
Q2 2009$48.25M+$57.96M+597.14%
Q1 2009$-9.71M$-16.34M-246.36%
Q4 2006$6.63M$-1.06M-13.76%
Q3 2006$7.69M$-661,043.748-7.92%
Q2 2006$8.35M+$3.05M+57.41%
Q1 2006$5.30M$-1.35M-20.26%
Q4 2005$6.65M+$1.12M+20.17%
Q3 2005$5.54M+$8.97M+261.18%
Q2 2005$-3.43M+$227,604.648+6.22%
Q1 2005$-3.66M+$5.97M+61.99%
Q4 2004$-9.63M$-13.16M-373.07%
Q3 2004$3.53M+$550,120.642+18.47%
Q2 2004$2.98M+$4.19M+346.04%
Q1 2004$-1.21M+$6.05M+83.34%
Q4 2003$-7.26M$-3.31M-83.72%
Q3 2003$-3.95M$-2.88M-268.35%
Q2 2003$-1.07M+$2.27M+67.87%
Q1 2003$-3.34M+$279,927.746+7.73%
Q4 2002$-3.62M$-953,800.583-35.76%
Q3 2002$-2.67M+$663,319.181+19.91%
Q2 2002$-3.33M+$1.82M+35.38%
Q1 2002$-5.15M+$4.04M+43.92%
Q4 2001$-9.19M$-9.03M-5614.43%
Q3 2001$-160,861.959$-620,025.862-135.03%
Q2 2001$459,163.902$-7.05M-93.89%
Q1 2001$7.51M$-3.73M-33.19%
Q4 2000$11.24M+$1.90M+20.31%
Q3 2000$9.35M+$4.03M+75.64%
Q2 2000$5.32M
Data as of Saturday, June 27, 2026

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman