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BESIYBE Semiconductor Industries N.V.

Income Tax Expense

The latest quarterly tax expense is $8.40 Million with a quarter-over-quarter change of -10.56%. Income tax expense is the amount a company pays in federal, state, and foreign income taxes based on its taxable income for the period.

Tax Expense

BESIY Tax Expense

$8.40M

Reported quarterly tax expense; no daily interpolation.

-31.63% 5Y

Current Tax Expense

$8.40M

$8.40 Million

Quarter-over-Quarter Change

-10.56%

vs. $9.40M prior quarter

Historical Data

96

Quarters of data available

Quarterly Tax Expense History

PeriodTax ExpenseQoQ Change% Change
Q1 2026$8.40M$-992,436.473-10.56%
Q4 2025$9.40M+$5.08M+117.74%
Q3 2025$4.32M$-2.46M-36.30%
Q2 2025$6.78M+$1.59M+30.60%
Q1 2025$5.19M+$18.23M+139.78%
Q4 2024$-13.04M$-20.52M-274.33%
Q3 2024$7.48M+$775,238.67+11.56%
Q2 2024$6.71M+$78,103.46+1.18%
Q1 2024$6.63M$-4.96M-42.82%
Q4 2023$11.59M+$5.36M+86.13%
Q3 2023$6.23M$-3.15M-33.61%
Q2 2023$9.38M+$3.29M+53.98%
Q1 2023$6.09M+$819,665.94+15.55%
Q4 2022$5.27M$-2.98M-36.08%
Q3 2022$8.25M$-3.33M-28.75%
Q2 2022$11.57M$-616.24-0.01%
Q1 2022$11.58M+$14.97M+441.23%
Q4 2021$-3.39M$-12.38M-137.76%
Q3 2021$8.98M$-3.31M-26.92%
Q2 2021$12.29M+$4.94M+67.13%
Q1 2021$7.36M+$16.90M+177.08%
Q4 2020$-9.54M$-15.18M-269.15%
Q3 2020$5.64M$-996,064.05-15.01%
Q2 2020$6.64M+$4.07M+158.18%
Q1 2020$2.57M+$14.13M+122.24%
Q4 2019$-11.56M$-14.61M-478.91%
Q3 2019$3.05M$-314,730.36-9.35%
Q2 2019$3.37M+$1.84M+120.97%
Q1 2019$1.52M+$2.25M+308.29%
Q4 2018$-731,322.72$-6.67M-112.32%
Q3 2018$5.94M$-2.24M-27.42%
Q2 2018$8.18M$-695,413.8-7.83%
Q1 2018$8.88M+$2.69M+43.53%
Q4 2017$6.18M$-3.27M-34.57%
Q3 2017$9.45M$-41,559.98-0.44%
Q2 2017$9.49M+$4.61M+94.32%
Q1 2017$4.89M+$1.77M+56.74%
Q4 2016$3.12M+$798,680.4+34.45%
Q3 2016$2.32M+$328,410.08+16.50%
Q2 2016$1.99M+$353,217.31+21.58%
Q1 2016$1.64M$-1.09M-39.96%
Q4 2015$2.73M+$1.65M+152.57%
Q3 2015$1.08M$-1.23M-53.19%
Q2 2015$2.31M$-484,946.64-17.37%
Q1 2015$2.79M+$9.48M+141.73%
Q4 2014$-6.69M$-9.78M-316.38%
Q3 2014$3.09M$-137,437.74-4.26%
Q2 2014$3.23M+$1.96M+155.43%
Q1 2014$1.26M+$2.28M+224.64%
Q4 2013$-1.01M$-2.12M-191.88%
Q3 2013$1.10M$-1.22M-52.50%
Q2 2013$2.32M+$838,323.13+56.44%
Q1 2013$1.49M+$6.54M+129.39%
Q4 2012$-5.05M$-8.29M-256.05%
Q3 2012$3.24M$-1.49M-31.50%
Q2 2012$4.73M+$2.99M+171.79%
Q1 2012$1.74M+$1.35M+344.47%
Q4 2011$391,367.84$-1.83M-82.37%
Q3 2011$2.22M$-2.65M-54.38%
Q2 2011$4.87M+$1.17M+31.67%
Q1 2011$3.70M+$6.44M+234.47%
Q4 2010$-2.75M$-7.36M-159.61%
Q3 2010$4.61M+$7.43M+263.15%
Q2 2010$-2.83M$-4.34M-286.25%
Q1 2010$1.52M+$1.41M+1292.64%
Q4 2009$108,926.24$-683,092.35-86.25%
Q3 2009$792,018.59+$1.51M+210.24%
Q2 2009$-718,417.92+$31,447.18+4.19%
Q1 2009$-749,865.1$-656,927.966-706.85%
Q4 2006$-92,937.134$-1.48M-106.71%
Q3 2006$1.38M+$1.51M+1172.39%
Q2 2006$-129,122.966$-612,003.803-126.74%
Q1 2006$482,880.837+$705,193.965+317.21%
Q4 2005$-222,313.128$-734,807.552-143.38%
Q3 2005$512,494.424+$2.33M+128.16%
Q2 2005$-1.82M+$141,394.688+7.21%
Q1 2005$-1.96M+$1.90M+49.21%
Q4 2004$-3.86M$-4.48M-722.79%
Q3 2004$620,002.894+$145,902.128+30.77%
Q2 2004$474,100.766+$1.05M+182.49%
Q1 2004$-574,704.588+$1.45M+71.57%
Q4 2003$-2.02M$-1.27M-167.44%
Q3 2003$-755,873.562$-433,927.389-134.78%
Q2 2003$-321,946.173+$499,160.315+60.79%
Q1 2003$-821,106.488$-7.03M-113.22%
Q4 2002$6.21M+$7.05M+834.04%
Q3 2002$-845,838.706+$218,225.642+20.51%
Q2 2002$-1.06M+$308,618.068+22.48%
Q1 2002$-1.37M+$1.72M+55.56%
Q4 2001$-3.09M$-3.20M-2812.10%
Q3 2001$113,900.949$-272,236.376-70.50%
Q2 2001$386,137.325$-2.31M-85.70%
Q1 2001$2.70M$-1.32M-32.83%
Q4 2000$4.02M+$4.67M+715.27%
Q3 2000$-653,412.738$-2.49M-135.54%
Q2 2000$1.84M
Data as of Saturday, June 27, 2026

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman