Amkor Technology, Inc. (AMKR) Stock Price: $86.72-6.83 (-7.30%)
At close: Jun 23, 2026, 4:00 PM ET
The closing share price for Amkor Technology, Inc. (AMKR) stock was $86.72 for Tuesday, June 23, 2026, down 7.30% on the day.
Longer view (total return, dividends reinvested): past 12 months +332.1% · 3-year avg +51.1%/yr · 5-year avg +31.6%/yr
AMKR Price Chart
AMKR is featured in
AMKR Key Metrics
See All MetricsLAST CLOSE PRICE
$86.72
52-WEEK RANGE
$20.50 - $96.68
BETA
2.26
% FROM 52W HIGH
-10.30%
MARKET CAP
$21.50B
DIVIDEND YIELD
0.38%
PE RATIO
trailing TTM
49.55
PE RATIO (FWD)
next-FY estimate
41.68
P/B RATIO
4.77
DEBT / EQUITY
0.35
REVENUE TTM
$7.07B
NET INCOME TTM
$436.12M
NET PROFIT MARGIN TTM
6.17%
TTM TOTAL RETURN
+332.12%
3Y TOTAL RETURN
+51.10%
5Y TOTAL RETURN
+31.61%
AMKR Earnings Preview
Next Earnings Date
Jul 27, 2026
33 days away
EPS Estimate
0.47
Revenue Est.
$1.81B
Last Quarter Results
EPS
$0.33
vs Estimate
$0.24
Revenue
$1.68B
vs Estimate
$1.63B
AMKR Analyst Ratings
Consensus Rating
Based on 8 analysts
Average Price Target
$75.50
-12.9% downside
Low
$60.00
Current
$86.72
High
$90.00
AMKR Analyst Estimates
Earnings Per Share (EPS) Estimates
Quarterly
| Period | Low | Avg | High | # Analysts |
|---|---|---|---|---|
| Q1 2027 | $0.42 | $0.44 | $0.45 | 1 |
| Q2 2027 | $0.48 | $0.50 | $0.52 | 1 |
| Q3 2027 | $0.66 | $0.68 | $0.71 | 1 |
| Q4 2027 | $0.62 | $0.64 | $0.67 | 1 |
Annual
| Period | Low | Avg | High | # Analysts |
|---|---|---|---|---|
| FY 2026 | $2.07 | $2.08 | $2.09 | 5 |
| FY 2027 | $2.09 | $2.27 | $2.46 | 4 |
Revenue Estimates
Quarterly
| Period | Low | Avg | High | # Analysts |
|---|---|---|---|---|
| Q1 2027 | $1.81B | $1.86B | $1.91B | 2 |
| Q2 2027 | $1.92B | $1.97B | $2.03B | 2 |
| Q3 2027 | $2.27B | $2.33B | $2.40B | 2 |
| Q4 2027 | $2.21B | $2.28B | $2.34B | 2 |
Annual
| Period | Low | Avg | High | # Analysts |
|---|---|---|---|---|
| FY 2026 | $7.56B | $7.61B | $7.68B | 7 |
| FY 2027 | $8.11B | $8.42B | $8.73B | 6 |
Source: FMP Analyst Consensus Estimates. Forward P/E uses the next-fiscal-year consensus EPS estimate (the same value shown in the Key Metrics strip).
Related Stocks
TechnologyAMKR Competitors' Key Metrics
| Stock | Market Cap | Close Price | Price Change | TTM Total Return | 5Y CAGR | 10Y CAGR | Compare |
|---|---|---|---|---|---|---|---|
| 1AMKR | $21.50B | $86.72 | -7.30% | +332.12% | +31.61% | +30.94% | — |
| 2TEAM | $21.37B | $81.35 | +1.74% | -57.82% | -21.19% | +11.75% | vs AMKR |
| 3HPQ | $21.65B | $23.67 | +0.55% | +4.08% | -0.48% | +9.87% | vs AMKR |
| 4FFIV | $21.98B | $389.53 | -0.44% | +32.03% | +16.15% | +12.36% | vs AMKR |
| 5CPAY | $22.18B | $339.36 | -2.25% | +5.44% | +5.87% | +8.77% | vs AMKR |
| 6FN | $20.76B | $583.55 | -5.44% | +109.54% | +43.54% | +32.41% | vs AMKR |
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About Amkor Technology, Inc.
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Kevin K. Engel