SEC Filings

Filing links are provided when reliable SEC filing data is available.

Recent Filings

Form	Filing Date	Accepted	Document
4	Sep 10, 2026	Sep 10, 2026	View filing
4	Aug 19, 2026	Aug 19, 2026	View filing
4	Aug 13, 2026	Aug 13, 2026	View filing
4	Aug 11, 2026	Aug 11, 2026	View filing
4	Aug 7, 2026	Aug 7, 2026	View filing
4	Jul 31, 2026	Jul 31, 2026	View filing
4	Jul 31, 2026	Jul 31, 2026	View filing
10-Q	Jul 28, 2026	Jul 28, 2026	View filing
8-K	Jul 27, 2026	Jul 27, 2026	View filing
4	Jul 22, 2026	Jul 22, 2026	View filing
4	Jul 22, 2026	Jul 22, 2026	View filing
4	Jul 20, 2026	Jul 20, 2026	View filing
4	Jul 16, 2026	Jul 16, 2026	View filing
4	Jul 2, 2026	Jul 2, 2026	View filing
4	Jul 2, 2026	Jul 2, 2026	View filing
4	Jul 2, 2026	Jul 2, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 25, 2026	Jun 25, 2026	View filing
4	Jun 18, 2026	Jun 18, 2026	View filing
4	Jun 16, 2026	Jun 16, 2026	View filing
4	Jun 12, 2026	Jun 12, 2026	View filing
4	Jun 11, 2026	Jun 11, 2026	View filing

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ

30,800 employees

amkor.com

Technology / Semiconductors

Sector: Technology
Industry: Semiconductors
CEO: Kevin K. Engel

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