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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) SEC Filings

Filing links are provided when reliable SEC filing data is available.

Recent Filings

FormFiling DateAcceptedDocument
4Jun 18, 2026Jun 18, 2026View filing
4Jun 16, 2026Jun 16, 2026View filing
4Jun 12, 2026Jun 12, 2026View filing
4Jun 11, 2026Jun 11, 2026View filing
SDMay 22, 2026May 22, 2026View filing
8-KMay 21, 2026May 21, 2026View filing
4May 20, 2026May 20, 2026View filing
4May 20, 2026May 20, 2026View filing
8-KMay 19, 2026May 19, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 15, 2026May 15, 2026View filing
4May 13, 2026May 13, 2026View filing
4May 12, 2026May 12, 2026View filing
4May 7, 2026May 7, 2026View filing
4May 7, 2026May 7, 2026View filing
4May 7, 2026May 7, 2026View filing
8-KMay 5, 2026May 5, 2026View filing
SC 13D/AMay 5, 2026May 5, 2026View filing
8-KMay 1, 2026May 1, 2026View filing
8-KApr 30, 2026Apr 30, 2026View filing
10-QApr 28, 2026Apr 28, 2026View filing
8-KApr 27, 2026Apr 27, 2026View filing

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel