Amkor Technology, Inc. logo
Amkor Technology, Inc. (AMKR)
Compare

AMKR Dividends

Amkor Technology, Inc. (AMKR) pays $0.33 in dividends per share, with a current dividend yield of 0.40%. The company has dividend history for 1 consecutive years.

AMKR Dividend Summary

Consecutive Years

1

Most Recent Ex-Date

Jun 3, 2026

Most Recent Payment

Jun 23, 2026

AMKR Dividends per Share (Nominal History)

View full nominal table list

This step chart displays the nominal dividend payouts over time on their actual payment dates, matching the distribution frequency.

AMKR Dividends CAGR Chart

Amkor Technology, Inc. (AMKR)

Annual Dividend History

YearDividend/ShareYoY Growth
2026(YTD)$0.17
2025$0.33N/A
2024$0.24N/A
2023$0.30+35.00%
2022$0.23+32.35%
2021$0.17N/A
2020$0.04N/A

Quarterly Dividend History

QuarterDividend/ShareYoY Growth
Q2 2026$0.08+1.00%
Q1 2026$0.08+1.00%
Q4 2025$0.08
Q3 2025$0.08+5.00%
Q2 2025$0.08+5.00%
Q1 2025$0.08+5.00%
Q3 2024$0.08+5.00%
Q2 2024$0.08+5.00%
Q1 2024$0.08+5.00%
Q4 2023$0.08+5.00%
Q3 2023$0.07+50.00%
Q2 2023$0.07+50.00%
Q1 2023$0.07+50.00%
Q4 2022$0.07+50.00%
Q3 2022$0.05+25.00%
Q2 2022$0.05+25.00%
Q1 2022$0.05+25.00%
Q4 2021$0.05+25.00%
Q3 2021$0.04
Q2 2021$0.04
Q1 2021$0.04
Q4 2020$0.04

Dividend Yield Metrics

Current Yield
0.40%
Average Yield (TTM)
0.40%
Average Yield (3Y)
0.35%
Forward Yield on Cost (3Y)
0.79%
Forward Yield on Cost (5Y)
1.23%
Forward Yield on Cost (10Y)
3.73%

Payout Ratio Analysis

Payout Ratio (Current)
19.04%
FCF Payout Ratio
49.26%
Payout Ratio (3Y Avg)
19.72%
Payout Ratio (5Y Avg)
14.56%
FCF Payout (3Y Avg)
24.71%
FCF Payout (5Y Avg)
23.03%

Dividend Coverage

Payout Ratio
19.0%
Dividends / net income
FCF Payout Ratio
49.3%
Dividends / free cash flow
Consecutive Years
1 years
Years with regular dividend payments
5Y Dividend Growth
52.7%
Compound annual dividend growth

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel