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Amkor Technology, Inc. (AMKR)
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AMKR Financials

SEC Filings

AMKR Quarterly Income Statement (USD)

Quarterly ReportTTM
03/31/2026
12/31/2025
09/30/2025
06/30/2025
03/31/2025
12/31/2024
09/30/2024
06/30/2024
7.071B1.685B1.888B1.987B1.511B1.322B1.629B1.862B1.461B
Cost of Goods Sold
6.051B1.446B1.573B1.702B1.329B1.164B1.382B1.589B1.249B
1.020B239.032M314.629M284.490M181.897M157.583M246.710M272.484M212.375M
14.2%14.2%16.7%14.3%12.0%11.9%15.1%14.6%14.5%
Total Operating Expenses
483.899M138.745M129.661M125.563M89.930M126.060M112.275M123.117M130.848M
162.849M41.758M36.731M42.352M42.008M45.652M42.848M42.364M39.568M
321.050M96.987M92.930M83.211M47.922M80.408M69.427M80.753M91.280M
536.149M100.287M184.968M158.927M91.967M31.523M134.435M149.367M81.527M
6.0%6.0%9.8%8.0%6.1%2.4%8.3%8.0%5.6%
515.138M96.308M181.219M154.397M83.214M25.789M135.589M141.875M81.570M
Interest Income
64.164M16.220M15.843M17.109M14.992M14.453M15.185M15.862M17.698M
76.345M17.710M20.594M21.231M16.810M16.809M17.079M15.622M15.805M
Other Income/Expense
-21.011M-3.979M-3.749M-4.530M-8.753M-5.734M1.154M-7.492M43K
436.118M83.351M171.761M126.589M54.417M21.128M105.649M122.569M66.897M
76.909M12.342M8.690M27.715M28.162M3.936M29.788M19.185M14.312M
4.9%4.9%9.1%6.4%3.6%1.6%6.5%6.6%4.6%
1.251B284.921M367.544M339.242M258.866M196.419M301.861M308.093M247.324M
16.9%16.9%19.5%17.1%17.1%14.9%18.5%16.6%16.9%
659.090M170.903M165.731M163.614M158.842M153.821M149.193M150.596M149.949M
1.760.340.690.510.220.090.430.500.27
1.750.330.690.510.220.090.430.490.27
247.550M247.550M247.158M247.158M246.854M246.854M246.480M246.480M246.228M
249.570M249.570M248.302M248.302M247.845M247.845M247.922M247.922M247.860M

AMKR Annual Income Statement (USD)

Annual Report
12/31/2025
12/31/2024
12/31/2023
12/31/2022
12/31/2021
12/31/2020
12/31/2019
12/31/2018
6.708B6.318B6.503B7.092B6.138B5.051B4.053B4.316B
Cost of Goods Sold
5.769B5.384B5.560B5.762B4.913B4.150B3.403B3.606B
938.599M933.212M943.153M1.330B1.226B900.814M649.439M710.565M
14.0%14.8%14.5%18.8%20.0%17.8%16.0%16.5%
Total Operating Expenses
471.214M494.757M472.866M432.801M462.121M443.569M419.571M452.421M
166.743M162.951M177.473M149.429M166.037M140.727M137.638M157.182M
304.471M331.806M295.393M283.372M296.084M302.842M281.933M295.239M
467.385M438.455M470.287M897.186M763.433M457.245M233.170M258.144M
7.0%6.9%7.2%12.7%12.4%9.1%5.8%6.0%
444.619M431.016M443.841M856.932M715.066M386.682M159.810M185.815M
Interest Income
62.397M65.541M48.458M12.762M1.065M5.449M6.655M4.133M
75.444M64.945M59.000M58.563M51.508M64.168M71.587M78.946M
Other Income/Expense
-22.766M-7.439M-26.446M-40.254M-48.367M-70.563M-73.360M-72.329M
373.895M354.012M359.813M765.823M642.995M338.138M120.888M127.092M
68.503M75.481M81.710M89.890M69.459M46.183M37.182M56.250M
5.6%5.6%5.5%10.8%10.5%6.7%3.0%2.9%
1.162B1.091B1.134B1.528B1.330B961.246M758.889M836.722M
17.3%17.3%17.4%21.5%21.7%19.0%18.7%19.4%
642.008M594.663M631.508M612.702M563.582M510.396M524.177M571.961M
1.511.441.463.132.641.400.500.53
1.501.431.463.112.621.400.500.53
247.158M246.480M245.628M244.676M243.878M241.509M239.725M239.329M
248.302M247.922M247.176M246.205M245.704M242.248M240.122M239.741M

Values are displayed in USD. Negative numbers shown in red.

Values are displayed in USD. Negative numbers are shown in red.

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel