Amkor Technology, Inc. (AMKR) Total Return:332.12%(TTM)
Over the latest trailing 12-month period, Amkor Technology, Inc. (AMKR)'s total return cagr is +332.12%. The comparable SPY value is +22.76%. Year-to-date total return is +120.34%. Total return includes price appreciation and reinvested dividends.
Growth of $10,000 in AMKR
$68,887
(6.9x return)
Invested on May 1, 1998
Growth of $10,000 in SPY (S&P 500)
$111,356
(11.1x return)
Invested on May 1, 1998
Hypothetical Growth of $10,000
This chart illustrates the cumulative performance of a hypothetical $10,000 investment. It assumes that all dividends paid by both the stock and SPY are reinvested in additional shares on the payment date, showing the true long-term compounding impact of distributions.
Recent Performance Indicators
YTD Total Return
+120.3%
1-Year Total Return
+331.7%
Current Dividend Yield
0.38%
Price CAGR vs. Total Return CAGR
Compound Annual Growth Rate (CAGR) is shown below. The difference between price CAGR and total return CAGR is the compound contribution of dividends reinvested.
| Holding Period | Price CAGR | Total Return CAGR | Dividend Addition |
|---|---|---|---|
| 1 Year | +328.5% | +332.1% | +3.7% |
| 3 Years | +49.6% | +51.1% | +1.5% |
| 5 Years | +30.3% | +31.6% | +1.3% |
| 10 Years | +30.2% | +30.9% | +0.7% |
| 15 Years | +19.5% | +19.9% | +0.4% |
| 20 Years | +11.9% | +12.2% | +0.3% |
About Amkor Technology, Inc.
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Kevin K. Engel