Amkor Technology, Inc. (AMKR) Operating Cash Flow CAGR:27.96%(TTM)
Operating cash flow CAGR uses precomputed cash-flow statement history (cash from operations, before capital expenditures).
Over longer horizons, Amkor Technology, Inc.'s Operating Cash Flow CAGR averages 3.15% over 3 years and 7.43% over 5 years.The TTM figure compares the trailing 12 months (sum of the latest four quarters) with the 12 months before that. Rows in the history table compare fiscal years, and the quarterly table compares single quarters; the three measure different windows and will differ. Operating cash flow CAGR measures the compound annual growth rate of the cash Amkor Technology, Inc. generates from its core business operations, before capital expenditures, computed from rolling-twelve-month cash-flow statement history.
AMKR Operating Cash Flow CAGR Chart
Amkor Technology, Inc. (AMKR)
AMKR Quarterly Operating Cash Flow Growth (YoY)
Operating Cash Flow growth vs the same quarter one year earlier, last 20 quarters.
AMKR Operating Cash Flow CAGR History
| Year | Start OCF | End OCF | Change | % Change | CAGR |
|---|---|---|---|---|---|
| 2025 | $1.09B | $1.10B | +$6.74M | +0.62% | +0.62% |
| 2024 | $1.27B | $1.09B | $-181.15M | -14.26% | -14.26% |
| 2023 | $1.10B | $1.27B | +$171.26M | +15.59% | +15.59% |
| 2022 | $1.12B | $1.10B | $-22.54M | -2.01% | -2.01% |
| 2021 | $770.03M | $1.12B | +$351.26M | +45.62% | +45.62% |
| 2020 | $563.85M | $770.03M | +$206.18M | +36.57% | +36.57% |
| 2019 | $663.41M | $563.85M | $-99.56M | -15.01% | -15.01% |
| 2018 | $618.27M | $663.41M | +$45.14M | +7.30% | +7.30% |
| 2017 | $729.40M | $618.27M | $-111.14M | -15.24% | -15.24% |
| 2016 | $577.95M | $729.40M | +$151.46M | +26.21% | +26.21% |
| 2015 | $613.91M | $577.95M | $-35.96M | -5.86% | -5.86% |
| 2014 | $557.54M | $613.91M | +$56.37M | +10.11% | +10.11% |
| 2013 | $382.96M | $557.54M | +$174.57M | +45.58% | +45.58% |
| 2012 | $516.83M | $382.96M | $-133.87M | -25.90% | -25.90% |
| 2011 | $542.60M | $516.83M | $-25.76M | -4.75% | -4.75% |
| 2010 | $261.73M | $542.60M | +$280.87M | +107.31% | +107.31% |
| 2009 | $605.82M | $261.73M | $-344.09M | -56.80% | -56.80% |
| 2008 | $603.43M | $605.82M | +$2.39M | +0.40% | +0.40% |
| 2007 | $523.63M | $603.43M | +$79.80M | +15.24% | +15.24% |
| 2006 | $97.11M | $523.63M | +$426.52M | +439.20% | +439.20% |
| 2005 | $216.61M | $97.11M | $-119.50M | -55.17% | -55.17% |
| 2004 | $176.35M | $216.61M | +$40.27M | +22.83% | +22.83% |
| 2003 | $176.48M | $176.35M | $-131.00K | -0.07% | -0.07% |
| 2002 | $160.47M | $176.48M | +$16.01M | +9.98% | +9.98% |
| 2001 | $373.82M | $160.47M | $-213.36M | -57.07% | -57.07% |
| 2000 | $293.30M | $373.82M | +$80.53M | +27.46% | +27.46% |
| 1999 | $237.96M | $293.30M | +$55.34M | +23.25% | +23.25% |
| 1998 | $250.05M | $237.96M | $-12.09M | -4.84% | -4.84% |
Quarterly Operating Cash Flow: QoQ & YoY
| Quarter | Value | QoQ | YoY |
|---|---|---|---|
| Q1 2026 | $145.09M | -77.5% | +500.8% |
| Q4 2025 | $644.48M | +282.4% | +19.9% |
| Q3 2025 | $168.51M | -34.8% | +2.6% |
| Q2 2025 | $258.46M | +970.3% | +15.0% |
| Q1 2025 | $24.15M | -95.5% | -85.1% |
| Q4 2024 | $537.61M | +227.4% | -6.3% |
| Q3 2024 | $164.19M | -26.9% | -40.0% |
| Q2 2024 | $224.76M | +38.5% | -8.9% |
| Q1 2024 | $162.31M | -71.7% | -7.6% |
| Q4 2023 | $573.83M | +109.7% | +3.8% |
| Q3 2023 | $273.61M | +10.8% | +227.7% |
| Q2 2023 | $246.83M | +40.4% | -16.6% |
| Q1 2023 | $175.75M | -68.2% | +5.8% |
| Q4 2022 | $552.99M | +562.3% | +12.9% |
| Q3 2022 | $83.50M | -71.8% | -52.4% |
| Q2 2022 | $296.09M | +78.2% | +5.9% |
QoQ = change vs the prior quarter; YoY = change vs the same quarter a year earlier.
About Amkor Technology, Inc.
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Kevin K. Engel