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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) Enterprise Value (EV): $20.65B

The enterprise value (EV) for Amkor Technology, Inc. (AMKR) is $20.65B as of Wednesday, June 24, 2026.

AMKR Enterprise Value (EV) Metrics

ENTERPRISE VALUE (EV)

$20.65B

AMKR Competitors' Enterprise Value (EV)

NAMEMARKET CAPENTERPRISE VALUE (EV)
Amkor Technology, Inc. (AMKR)$20.51B$20.65B
Zscaler, Inc. (ZS)vs ›$20.40B$43.50B
Fabrinet (FN)vs ›$20.76B$10.35B
HP Inc. (HPQ)vs ›$21.30B$33.37B
Atlassian Corporation (TEAM)vs ›$21.37B$51.89B
Fidelity National Information Services, Inc. (FIS)vs ›$19.66B$37.77B
Cognizant Technology Solutions Corporation (CTSH)vs ›$19.64B$39.60B
Okta, Inc. (OKTA)vs ›$19.63B$14.42B
F5, Inc. (FFIV)vs ›$21.98B$17.86B
Corpay, Inc. (CPAY)vs ›$22.18B$22.23B

Enterprise Value Calculation

Market Cap

$20.51B

+

Total Debt

$1.52B

Cash

$1.38B

=

Enterprise Value

$20.65B

EV-Based Valuation Multiples

Why use EV instead of Market Cap?

  • EV accounts for debt - an acquirer must pay or assume it
  • EV deducts cash - the acquirer effectively receives it
  • EV enables fair comparison of companies with different capital structures
  • EV-based ratios (EV/EBITDA, EV/Sales) are capital structure neutral

Amkor Technology, Inc. Enterprise Value (EV) Formula & Definition

Enterprise Value represents the total value of a company as if you were to acquire it completely - paying for equity while assuming debt and receiving cash.

Expanded definitions: Investopedia, Wikipedia, Corporate Finance Institute

Amkor Technology, Inc. Enterprise Value (EV) FAQ

What is the enterprise value (EV) for Amkor Technology, Inc. (AMKR)?
The enterprise value (EV) for AMKR stock is $20.65B.

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel