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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) Price History:295.22%(TTM)

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Over the latest trailing 12-month period, Amkor Technology, Inc. (AMKR)'s price cagr is +295.22%. The comparable SPY value is +22.25%. Year-to-date price return is +92.82%. Price CAGR uses adjusted close price history and excludes dividends.

Current Price

$82.76

$-3.96 (-4.57%)

Previous Close: $86.72

Last Session

Open
$87.49
Day High
$87.66
Day Low
$80.22
Volume
4.36M
Avg Volume
5.09M

52-Week Position

82%

of the 52-week price range

From 52-week high
-14.40%
From 52-week low
+301.94%

52-Week Price Range

52-Week Low

$20.59

Jun 30, 2025

Current Price

$82.76

82% of range

52-Week High

$96.68

Jun 22, 2026

Low (+301.94% from current)(-14.40% from current) High

Price Returns by Period

1 Day

-4.57%

7 Days

-4.25%

30 Days

+25.87%

YTD

+92.82%

1 Year

+294.85%

vs 52W High

-14.40%

AMKR Price Chart

End-of-day pricesAdvanced chart →
AMKR$82.76 294.85%(1Y)as of Jun 24, 2026

Long-Term Performance (CAGR)

Price CAGR (3Y)

+47.23%

Price CAGR (5Y)

+28.31%

Total Return CAGR (3Y)

+48.71%

Total Return CAGR (5Y)

+29.59%

CAGR (Compound Annual Growth Rate) shows the annualized return over the specified period. Total Return includes dividends reinvested.

Key Price Statistics

Current Price$82.76
Previous Close$86.72
Day Range$80.22 - $87.66
52-Week Range$20.59 - $96.68
Volume4.36M
Average Volume5.09M
Market Cap$20.51B
% from 52W High-14.40%
Data as of Wednesday, June 24, 2026

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel