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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) Short-Term Debt

The short-term debt for Amkor Technology, Inc. (AMKR) is $185.57 Million with a year-over-year change of -41.73%. Short-term debt includes all borrowings and debt obligations due within one year, including the current portion of long-term debt, commercial paper, and credit facilities.

AMKR Short-Term Debt

AMKR Short-Term Debt Chart

$185.57M

Reported annual fiscal-period values; no daily interpolation.

+141.72% 10Y

Current Short-Term Debt

$185.57M

$185.57 Million

Year-over-Year Change

-41.73%

vs. $318.47M prior year

Historical Data

29

Years of data available

Annual Short-Term Debt History

YearShort-Term DebtYoY Change% Change
2025$185.57M$-132.90M-41.73%
2024$318.47M+$95.47M+42.81%
2023$223.00M$-48.37M-17.83%
2022$271.37M+$23.21M+9.35%
2021$248.16M+$36.77M+17.39%
2020$211.39M+$16.82M+8.64%
2019$194.57M+$79.99M+69.81%
2018$114.58M$-9.27M-7.48%
2017$123.85M+$88.66M+251.92%
2016$35.19M$-41.58M-54.16%
2015$76.77M+$71.77M+1435.40%
2014$5.00M$-56.35M-91.85%
2013$61.35M+$61.35M
2012$0$-59.40M-100.00%
2011$59.40M$-90.69M-60.42%
2010$150.08M+$61.14M+68.74%
2009$88.94M+$34.34M+62.87%
2008$54.61M$-97.88M-64.19%
2007$152.49M$-32.92M-17.76%
2006$185.41M+$1.02M+0.56%
2005$184.39M+$132.14M+252.90%
2004$52.25M+$20.89M+66.64%
2003$31.36M$-44.30M-58.56%
2002$75.66M+$15.72M+26.24%
2001$59.93M$-39.39M-39.66%
2000$99.32M+$76.64M+338.02%
1999$22.67M$-29.41M-56.47%
1998$52.09M$-145.00M-73.57%
1997$197.08M
Data as of Wednesday, June 24, 2026

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel