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Amkor Technology, Inc. (AMKR)
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AMKR Balance Sheet

Assets, liabilities, and equity analysis

AMKR Quarterly Balance Sheet (USD)

Quarterly ReportTTM
03/31/2026
12/31/2025
09/30/2025
06/30/2025
03/31/2025
12/31/2024
09/30/2024
06/30/2024
Total Current Assets
3.752B3.752B3.885B4.008B3.625B2.991B3.073B3.244B3.137B
1.121B1.121B1.378B1.496B1.527B1.058B1.134B959.140M1.080B
Short-Term Investments
727.317M727.317M613.038M614.703M516.430M505.181M512.984M512.333M465.804M
Cash & Short-Term Investments
1.849B1.849B1.991B2.110B2.044B1.563B1.647B1.471B1.545B
1.288B1.288B1.355B1.399B1.126B1.053B1.055B1.352B1.148B
494.620M494.620M437.797M399.892M375.249M326.185M310.910M349.513M379.259M
8.299B8.299B8.136B8.187B7.706B6.921B6.944B7.029B6.866B
4.241B4.241B3.964B3.934B3.900B3.746B3.686B3.653B3.587B
17.775M17.775M18.003M19.076M19.588M18.813M17.947M19.643M17.536M
Intangible Assets
0.000.000.000.000.000.000.000.000.00
Long-Term Investments
0.000.0067.776M60.758M755K768K759K786K762K
Total Current Liabilities
1.867B1.867B1.712B2.261B1.916B1.454B1.455B1.573B1.507B
832.101M832.101M912.766M925.268M760.108M608.464M712.887M811.946M734.755M
157.038M157.038M185.570M646.861M450.967M315.521M318.469M293.329M235.452M
Total Liabilities
3.729B3.729B3.630B3.845B3.474B2.731B2.761B2.832B2.782B
1.257B1.257B1.331B1.230B1.137B967.398M981.414M956.273M1.004B
1.523B1.523B1.565B2.020B1.752B1.457B1.481B1.312B1.294B
Net Debt (Cash)
401.700M401.700M187.137M524.558M224.971M399.794M347.021M352.741M214.209M
4.534B4.534B4.471B4.308B4.197B4.156B4.150B4.164B4.050B
Common Stock
294K294K294K294K294K293K293K293K293K
2.690B2.690B2.627B2.476B2.370B2.336B2.335B2.350B2.247B
2.012.012.271.771.892.062.112.062.08
0.340.340.350.470.420.350.360.320.32

AMKR Annual Balance Sheet (USD)

Annual Report
12/31/2025
12/31/2024
12/31/2023
12/31/2022
12/31/2021
12/31/2020
12/31/2019
12/31/2018
Total Current Assets
3.885B3.073B3.196B3.301B2.857B2.133B2.002B1.671B
1.378B1.134B1.120B959.072M826.744M698.002M894.948M681.569M
Short-Term Investments
613.038M512.984M474.869M281.964M251.530M133.769M0.000.00
Cash & Short-Term Investments
1.991B1.647B1.595B1.241B1.078B831.771M894.948M681.569M
1.355B1.055B1.149B1.366B1.259B962.643M850.753M724.456M
437.797M310.910M393.128M629.576M484.959M297.293M220.602M230.589M
8.136B6.944B6.771B6.822B6.039B5.022B4.696B4.495B
3.964B3.686B3.416B3.307B3.031B2.713B2.553B2.650B
18.003M17.947M20.003M21.517M24.516M27.325M25.976M25.720M
Intangible Assets
0.000.000.000.000.000.000.0026.845M
Long-Term Investments
67.776M759K799K3.334M3.815M3.188M2.974M3.893M
Total Current Liabilities
1.712B1.455B1.384B1.662B1.680B1.316B1.060B1.158B
912.766M712.887M754.453M899.164M828.727M636.434M571.054M530.398M
185.570M318.469M223.001M271.374M248.160M211.389M194.572M114.579M
Total Liabilities
3.630B2.761B2.776B3.122B3.066B2.668B2.705B2.640B
1.331B981.414M1.129B1.164B1.069B1.090B1.397B1.218B
1.565B1.481B1.441B1.602B1.454B1.399B1.697B1.332B
Net Debt (Cash)
187.137M347.021M321.381M642.479M627.678M700.622M801.091M648.153M
4.471B4.150B3.962B3.669B2.942B2.326B1.964B1.831B
Common Stock
294K293K292K291K290K289K287K285K
2.627B2.335B2.160B1.875B1.164B562.502M234.077M113.189M
2.272.112.311.991.701.621.891.44
0.350.360.360.440.490.600.860.73

Values are displayed in USD. Negative numbers shown in red.

Values are displayed in USD. Negative numbers are shown in red.

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel