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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) Interest Coverage Ratio: 6.20x

The interest coverage ratio for Amkor Technology, Inc. (AMKR) is 6.20x as of Wednesday, June 24, 2026.

AMKR Interest Coverage Ratio Metrics

INTEREST COVERAGE RATIO

6.20x

AMKR Competitors' Interest Coverage Ratio

NAMEMARKET CAPINTEREST COVERAGE RATIOTTM3Y5Y
Amkor Technology, Inc. (AMKR)$20.51B6.20xN/AN/AN/A
Zscaler, Inc. (ZS)vs ›$20.40B-13.49xN/AN/AN/A
Fabrinet (FN)vs ›$20.76BN/A1204.87x961.05x513.60x
HP Inc. (HPQ)vs ›$21.30B7.16x6.72x7.80x11.12x
Atlassian Corporation (TEAM)vs ›$21.37B-4.27x1.21x0.90x0.90x
Fidelity National Information Services, Inc. (FIS)vs ›$19.66B4.79x4.83x4.72x5.53x
Cognizant Technology Solutions Corporation (CTSH)vs ›$19.64B95.38x74.47x92.69x128.80x
Okta, Inc. (OKTA)vs ›$19.63B38.25x38.25x38.25x38.25x
F5, Inc. (FFIV)vs ›$21.98BN/AN/AN/AN/A
Corpay, Inc. (CPAY)vs ›$22.18B4.83x4.75x5.76x6.91x

Financial Health Indicators

Interest Coverage

6.2x

Debt/Equity

0.35

Current Ratio

2.27

Formula: Interest Coverage = EBIT / Interest Expense

Reference ranges:

  • < 1.5x: EBIT is less than 1.5 times interest expense
  • 1.5x - 3x: EBIT is between 1.5 and 3 times interest expense
  • 3x - 5x: EBIT is between 3 and 5 times interest expense
  • > 5x: EBIT is more than 5 times interest expense

Note: Interest coverage should be compared with historical interest expense, operating income, and industry capital structure.

Amkor Technology, Inc. Interest Coverage Ratio Formula & Definition

Interest Coverage = EBIT / Interest Expense

The interest coverage ratio measures operating earnings relative to interest expense.

Expanded definitions: Investopedia, Wikipedia, Corporate Finance Institute

Amkor Technology, Inc. Interest Coverage Ratio FAQ

What is the interest coverage ratio for Amkor Technology, Inc. (AMKR)?
The interest coverage ratio for AMKR stock is 6.20x.

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel