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Amkor Technology, Inc. (AMKR)
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Amkor Technology, Inc. (AMKR) Stock Price: $82.76-3.96 (-4.57%)

At close: Jun 24, 2026, 4:00 PM ET

The closing share price for Amkor Technology, Inc. (AMKR) stock was $82.76 for Wednesday, June 24, 2026, down 4.57% on the day.

Longer view (total return, dividends reinvested): past 12 months +298.6% · 3-year avg +48.7%/yr · 5-year avg +29.6%/yr

AMKR Price Chart

End-of-day pricesAdvanced chart →
AMKR$82.76 294.85%(1Y)as of Jun 24, 2026

AMKR Earnings Preview

Next Earnings Date

Jul 27, 2026

33 days away

EPS Estimate

0.47

Revenue Est.

$1.81B

Last Quarter Results

EPS

$0.33

vs Estimate

$0.24

Beat

Revenue

$1.68B

vs Estimate

$1.63B

Beat

AMKR Analyst Ratings

Consensus Rating

Buy

Based on 8 analysts

Strong Buy
2
Buy
3
Hold
5
Sell
0
Strong Sell
0

Average Price Target

$75.50

-8.8% downside

Low

$60.00

Current

$82.76

High

$90.00

AMKR Analyst Estimates

Forward P/E: 39.77

Earnings Per Share (EPS) Estimates

Quarterly

PeriodAvg# Analysts
Q1 2027$0.441
Q2 2027$0.501
Q3 2027$0.681
Q4 2027$0.641

Annual

PeriodAvg# Analysts
FY 2026$2.085
FY 2027$2.274

Revenue Estimates

Quarterly

PeriodAvg# Analysts
Q1 2027$1.86B2
Q2 2027$1.97B2
Q3 2027$2.33B2
Q4 2027$2.28B2

Annual

PeriodAvg# Analysts
FY 2026$7.61B7
FY 2027$8.42B6

Source: FMP Analyst Consensus Estimates. Forward P/E uses the next-fiscal-year consensus EPS estimate (the same value shown in the Key Metrics strip).

AMKR Competitors' Key Metrics

StockMarket CapTTM Total ReturnCompare
1AMKR$20.51B+298.59%
2ZS$20.40B-59.39%vs AMKR
3FN$20.76B+109.54%vs AMKR
4TEAM$21.37B-57.82%vs AMKR
5FIS$19.66B-51.24%vs AMKR
6OKTA$19.63B+19.78%vs AMKR

About Amkor Technology, Inc.

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

Tempe, AZ
28,300 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Kevin K. Engel