Debt to Equity Ratio: 1.14
Is the debt to equity ratio high or low?
The debt to equity ratio of 1.14 is 37% above its 5-year average of 0.83, around the middle of its 5-year range (0.43–1.51).
As of Saturday, June 27, 2026. 12.08% below its 12-month average of 1.29.
BESIY Debt to Equity Ratio
Reported quarterly debt to equity ratio; no daily interpolation.
BESIY Average Debt to Equity Ratio Chart
BESIY Current vs Average Debt to Equity Ratio Chart
BESIY Debt to Equity Ratio Metrics
DEBT TO EQUITY RATIO
1.14
DEBT TO EQUITY RATIO AVG TTM
1.29
DEBT TO EQUITY RATIO AVG 3Y
0.98
DEBT TO EQUITY RATIO AVG 5Y
0.83
DEBT TO EQUITY RATIO AVG 10Y
0.75
DEBT TO EQUITY RATIO AVG 15Y
0.53
DEBT TO EQUITY RATIO AVG 20Y
0.49
CURRENT VS TTM AVG
-12.08%
CURRENT VS 3Y AVG
+15.78%
CURRENT VS 5Y AVG
+36.59%
CURRENT VS 10Y AVG
+50.88%
CURRENT VS 15Y AVG
+112.38%
CURRENT VS 20Y AVG
+132.99%
BESIY Competitors' Debt to Equity Ratio
| NAME | MARKET CAP | DEBT TO EQUITY RATIO | TTM | 3Y | 5Y |
|---|---|---|---|---|---|
| BE Semiconductor Industries N.V. (BESIY) | $25.45B | 1.14 | 1.29 | 0.98 | 0.83 |
| Zoom Communications, Inc. (ZM)vs › | $25.36B | 0.01 | 0.01 | 0.01 | 0.02 |
| MongoDB, Inc. (MDB)vs › | $25.26B | 0.01 | 0.01 | 0.68 | 0.90 |
| MKS Inc. (MKSI)vs › | $26.09B | 1.73 | 1.90 | 1.74 | 1.29 |
| Entegris, Inc. (ENTG)vs › | $24.59B | 0.98 | 1.04 | 1.32 | 1.11 |
| Fiserv, Inc. (FISV)vs › | $26.37B | 1.13 | 1.02 | 0.88 | 0.81 |
| Splunk Inc. (SPLK)vs › | $26.44B | 4.40 | 4.40 | 7.05 | 4.64 |
| Strategy Inc (MSTR)vs › | $24.45B | 0.16 | 0.28 | 0.53 | 0.98 |
| Verisk Analytics, Inc. (VRSK)vs › | $23.87B | 16.30 | 24.37 | 15.25 | 10.59 |
| Fair Isaac Corporation (FICO)vs › | $27.43B | -1.76 | 2.79 | 2.48 | 2.10 |
Financial Health
Debt/Equity
1.14
Current Ratio
5.55
Debt to Equity Ratio Formula & Definition
Debt to Equity measures financial leverage by comparing total debt to shareholders' equity.
Expanded definitions: Investopedia, Wikipedia, Corporate Finance Institute
Debt to Equity Ratio FAQ
- What is the debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The debt to equity ratio for BESIY stock is 1.14.
- Is BE Semiconductor Industries N.V.'s debt to equity ratio high or low?
- The debt to equity ratio of 1.14 is 37% above its 5-year average of 0.83, around the middle of its 5-year range (0.43–1.51).
- What is the TTM average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The TTM average debt to equity ratio for BESIY stock is 1.29.
- What is the 3Y average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The 3Y average debt to equity ratio for BESIY stock is 0.98.
- What is the 5Y average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The 5Y average debt to equity ratio for BESIY stock is 0.83.
- What is the 10Y average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The 10Y average debt to equity ratio for BESIY stock is 0.75.
- What is the 15Y average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The 15Y average debt to equity ratio for BESIY stock is 0.53.
- What is the 20Y average debt to equity ratio for BE Semiconductor Industries N.V. (BESIY)?
- The 20Y average debt to equity ratio for BESIY stock is 0.49.
BESIY Debt to Equity Ratio History
| DATE | DEBT TO EQUITY RATIO |
|---|---|
| 2026-03-31 | 1.14 |
| 2025-12-31 | 1.27 |
| 2025-09-30 | 1.49 |
| 2025-06-30 | 1.51 |
| 2025-03-31 | 1.05 |
| 2024-12-31 | 1.09 |
| 2024-09-30 | 1.16 |
| 2024-06-30 | 0.46 |
| 2024-03-31 | 0.58 |
| 2023-12-31 | 0.76 |
| 2023-09-30 | 0.84 |
| 2023-06-30 | 0.85 |
| 2023-03-31 | 0.56 |
| 2022-12-31 | 0.55 |
| 2022-09-30 | 0.51 |
| 2022-06-30 | 0.53 |
| 2022-03-31 | 0.43 |
| 2021-12-31 | 0.50 |
| 2021-09-30 | 0.57 |
| 2021-06-30 | 0.67 |
| 2021-03-31 | 0.96 |
| 2020-12-31 | 1.10 |
| 2020-09-30 | 1.25 |
| 2020-06-30 | 0.97 |
| 2020-03-31 | 0.90 |
| 2019-12-31 | 0.97 |
| 2019-09-30 | 1.06 |
| 2019-06-30 | 1.09 |
| 2019-03-31 | 0.77 |
| 2018-12-31 | 0.74 |
| 2018-09-30 | 0.78 |
| 2018-06-30 | 0.83 |
| 2018-03-31 | 0.59 |
| 2017-12-31 | 0.65 |
| 2017-09-30 | 0.35 |
| 2017-06-30 | 0.38 |
| 2017-03-31 | 0.37 |
| 2016-12-31 | 0.40 |
| 2016-09-30 | 0.07 |
| 2016-06-30 | 0.07 |
| 2016-03-31 | 0.06 |
| 2015-12-31 | 0.06 |
| 2015-09-30 | 0.07 |
| 2015-06-30 | 0.07 |
| 2015-03-31 | 0.08 |
| 2014-12-31 | 0.05 |
| 2014-09-30 | 0.06 |
| 2014-06-30 | 0.07 |
| 2014-03-31 | 0.07 |
| 2013-12-31 | 0.07 |
| 2013-09-30 | 0.09 |
| 2013-06-30 | 0.10 |
| 2013-03-31 | 0.10 |
| 2012-12-31 | 0.10 |
| 2012-09-30 | 0.11 |
| 2012-06-30 | 0.11 |
| 2012-03-31 | 0.09 |
| 2011-12-31 | 0.09 |
| 2011-09-30 | 0.10 |
| 2011-06-30 | 0.05 |
| 2011-03-31 | 0.19 |
| 2010-12-31 | 0.20 |
| 2010-09-30 | 0.24 |
| 2010-06-30 | 0.25 |
| 2010-03-31 | 0.27 |
| 2009-12-31 | 0.31 |
| 2009-09-30 | 0.00 |
| 2009-06-30 | 0.00 |
| 2009-03-31 | 0.00 |
| 2006-12-31 | 0.31 |
| 2006-09-30 | 0.46 |
| 2006-06-30 | 0.45 |
| 2006-03-31 | 0.47 |
| 2005-12-31 | 0.46 |
| 2005-09-30 | 0.48 |
| 2005-06-30 | 0.49 |
| 2005-03-31 | 0.49 |
| 2004-12-31 | 0.08 |
| 2004-09-30 | 0.08 |
| 2004-06-30 | 0.08 |
| 2004-03-31 | 0.08 |
| 2003-12-31 | 0.05 |
| 2003-09-30 | 0.05 |
| 2003-06-30 | 0.04 |
| 2003-03-31 | 0.04 |
| 2002-12-31 | 0.05 |
| 2002-09-30 | 0.04 |
| 2002-06-30 | 0.05 |
| 2002-03-31 | 0.05 |
| 2001-12-31 | 0.05 |
| 2001-09-30 | 0.05 |
| 2001-06-30 | 0.05 |
| 2001-03-31 | 0.05 |
| 2000-12-31 | 0.05 |
| 2000-09-30 | 0.05 |
| 2000-06-30 | 0.05 |
Related Metrics
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman