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BESIYBE Semiconductor Industries N.V.

Balance Sheet

Assets, liabilities, and equity analysis

Quarterly Balance Sheet (USD)

Quarterly ReportTTM
03/31/2026
12/31/2025
09/30/2025
06/30/2025
03/31/2025
12/31/2024
09/30/2024
06/30/2024
Total Current Assets
1.090B1.090B1.006B964.224M966.026M1.088B1.034B1.064B607.808M
418.012M418.012M437.919M410.298M389.165M438.791M354.468M342.328M136.278M
Short-Term Investments
289.131M289.131M199.595M200.111M188.589M302.812M341.712M367.438M139.240M
Cash & Short-Term Investments
707.143M707.143M637.514M610.408M577.754M741.603M696.180M709.766M275.518M
215.588M215.588M203.882M176.728M254.254M184.326M188.316M188.469M187.012M
130.236M130.236M122.189M122.298M114.305M112.296M106.951M115.913M106.349M
1.387B1.387B1.308B1.258B1.258B1.340B1.278B1.299B832.183M
76.722M76.722M79.816M78.490M76.482M62.757M62.646M67.518M64.685M
52.078M52.078M52.639M52.782M52.872M49.326M47.643M50.415M48.959M
Intangible Assets
122.043M122.043M122.737M123.109M122.504M106.657M100.108M105.616M99.211M
Long-Term Investments
5.823M5.823M0.006.078M0.000.000.000.0099.211M
Total Current Liabilities
230.226M230.226M181.191M167.654M168.537M171.530M172.905M154.982M136.751M
78.909M78.909M66.364M59.767M55.938M50.394M54.498M54.794M55.289M
0.000.000.000.004.776M908K2.918M2.495M3.249M
Total Liabilities
858.148M858.148M818.752M832.488M837.432M784.731M759.234M780.327M367.030M
587.673M587.673M608.551M619.621M620.203M568.305M544.308M584.035M192.581M
600.367M600.367M621.837M633.119M637.087M581.942M564.041M601.041M214.354M
Net Debt (Cash)
182.355M182.355M183.918M222.821M247.922M143.151M209.573M258.713M78.076M
528.469M528.469M488.888M425.131M420.531M555.166M519.054M518.230M465.153M
Common Stock
0.000.00953K0.00956K555.166M840K518.230M869K
0.000.000.000.0060.934M0.00279.776M0.0072.901M
4.744.745.555.755.736.345.986.874.44
1.141.141.271.491.511.051.091.160.46

Annual Balance Sheet (USD)

Annual Report
12/31/2025
12/31/2024
12/31/2023
12/31/2022
12/31/2021
12/31/2020
12/31/2019
12/31/2018
Total Current Assets
1.006B1.034B759.702M1.002B1.066B922.935M617.507M690.830M
437.919M354.468M208.031M526.075M513.845M458.585M312.427M338.238M
Short-Term Investments
199.595M341.712M248.344M0.000.000.000.000.00
Cash & Short-Term Investments
637.514M696.180M456.375M526.075M513.845M458.585M312.427M338.238M
203.882M188.316M158.621M159.153M200.888M113.872M91.372M121.712M
122.189M106.951M102.102M98.560M107.459M63.088M52.271M68.940M
1.308B1.278B989.570M1.215B1.302B1.113B782.060M884.327M
79.816M62.646M61.543M54.302M46.092M46.069M46.589M32.676M
52.639M47.643M50.112M48.945M51.419M54.340M50.825M51.615M
Intangible Assets
122.737M100.108M445K86.898M78.257M61.885M47.799M43.872M
Long-Term Investments
0.000.000.000.0028.459M0.000.0057.224M
Total Current Liabilities
181.191M172.905M151.471M153.955M213.529M123.972M97.217M115.508M
66.364M54.498M51.754M44.329M85.047M53.770M33.979M37.949M
3.430M2.918M3.470M2.526M0.000.001.112M4.937M
Total Liabilities
818.752M759.234M524.436M542.090M597.369M659.805M447.065M458.365M
595.518M544.308M328.203M345.393M343.556M488.574M310.933M311.097M
612.241M564.041M352.273M366.866M355.706M500.702M324.568M316.034M
Net Debt (Cash)
174.135M209.573M144.241M-159.208M-158.140M42.117M12.141M-22.204M
488.888M519.054M465.135M672.495M704.951M453.480M334.995M425.962M
Common Stock
953K840K895K868K895K960K898K916K
139.541M279.776M286.676M234.733M297.350M155.659M86.880M144.043M
5.555.985.026.514.997.446.355.98
1.251.090.760.550.501.100.970.74

Values are displayed in USD. Negative numbers shown in red.

Values are displayed in USD. Negative numbers are shown in red.

About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.

Duiven
1,820 employees
Technology / Semiconductors
Sector
Technology
Industry
Semiconductors
CEO
Richard W. Blickman