Operating Cash Flow CAGR:32.82%(TTM)
Operating cash flow CAGR uses precomputed cash-flow statement history (cash from operations, before capital expenditures).
Over longer horizons, Operating Cash Flow CAGR averages -3.88% over 3 years and 6.79% over 5 years.The TTM figure compares the trailing 12 months (sum of the latest four quarters) with the 12 months before that. Rows in the history table compare fiscal years, and the quarterly table compares single quarters; the three measure different windows and will differ. Operating cash flow CAGR measures the compound annual growth rate of the cash BE Semiconductor Industries N.V. generates from its core business operations, before capital expenditures, computed from rolling-twelve-month cash-flow statement history.
BESIY Operating Cash Flow CAGR Chart
BE Semiconductor Industries N.V. (BESIY)
BESIY Quarterly Operating Cash Flow Growth (YoY)
Operating Cash Flow growth vs the same quarter one year earlier, last 20 quarters.
BESIY Operating Cash Flow CAGR History
| Year | Start OCF | End OCF | Change | % Change | CAGR |
|---|---|---|---|---|---|
| 2025 | $208.22M | $200.98M | $-7.24M | -3.47% | -3.47% |
| 2024 | $230.21M | $208.22M | $-21.99M | -9.55% | -9.55% |
| 2023 | $290.89M | $230.21M | $-60.67M | -20.86% | -20.86% |
| 2022 | $316.30M | $290.89M | $-25.41M | -8.03% | -8.03% |
| 2021 | $197.92M | $316.30M | +$118.38M | +59.81% | +59.81% |
| 2020 | $134.79M | $197.92M | +$63.13M | +46.84% | +46.84% |
| 2019 | $210.71M | $134.79M | $-75.92M | -36.03% | -36.03% |
| 2018 | $201.86M | $210.71M | +$8.85M | +4.38% | +4.38% |
| 2017 | $103.84M | $201.86M | +$98.02M | +94.40% | +94.40% |
| 2016 | $93.97M | $103.84M | +$9.87M | +10.50% | +10.50% |
| 2015 | $88.68M | $93.97M | +$5.29M | +5.97% | +5.97% |
| 2014 | $25.00M | $88.68M | +$63.68M | +254.68% | +254.68% |
| 2013 | $51.71M | $25.00M | $-26.71M | -51.65% | -51.65% |
| 2012 | $63.17M | $51.71M | $-11.46M | -18.14% | -18.14% |
| 2011 | $16.38M | $63.17M | +$46.80M | +285.79% | +285.79% |
| 2010 | $-5.66M | $16.38M | +$22.03M | N/A | N/A |
| 2009 | $32.66M | $-5.66M | $-38.32M | -117.32% | N/A |
| 2008 | $818.66K | $32.66M | +$31.85M | +3889.89% | +3889.89% |
| 2007 | $16.50M | $818.66K | $-15.68M | -95.04% | -95.04% |
| 2006 | $-664.73K | $16.50M | +$17.17M | N/A | N/A |
| 2005 | $-6.22M | $-664.73K | +$5.55M | N/A | N/A |
| 2004 | $6.66M | $-6.22M | $-12.87M | -193.36% | N/A |
| 2003 | $-4.44M | $6.66M | +$11.10M | N/A | N/A |
| 2002 | $13.37M | $-4.44M | $-17.81M | -133.20% | N/A |
| 2001 | $11.36M | $13.37M | +$2.00M | +17.63% | +17.63% |
| 2000 | $4.92M | $11.36M | +$6.45M | +131.09% | +131.09% |
Quarterly Operating Cash Flow: QoQ & YoY
| Quarter | Value | QoQ | YoY |
|---|---|---|---|
| Q1 2026 | $109.23M | +98.3% | +127.3% |
| Q4 2025 | $55.10M | -21.6% | -16.7% |
| Q3 2025 | $70.24M | +129.2% | -12.4% |
| Q2 2025 | $30.64M | -36.2% | +481.7% |
| Q1 2025 | $48.06M | -27.4% | -26.1% |
| Q4 2024 | $66.15M | -17.5% | +12.4% |
| Q3 2024 | $80.20M | +1422.6% | +16.4% |
| Q2 2024 | $5.27M | -91.9% | -83.2% |
| Q1 2024 | $65.01M | +10.5% | -2.3% |
| Q4 2023 | $58.83M | -14.6% | -36.5% |
| Q3 2023 | $68.88M | +119.7% | -37.6% |
| Q2 2023 | $31.35M | -52.9% | +8.5% |
| Q1 2023 | $66.56M | -28.2% | +33.8% |
| Q4 2022 | $92.69M | -16.1% | -20.0% |
| Q3 2022 | $110.46M | +282.1% | -3.2% |
| Q2 2022 | $28.90M | -41.9% | -52.4% |
QoQ = change vs the prior quarter; YoY = change vs the same quarter a year earlier.
About BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V. (BESI) is a global provider of advanced equipment and services for semiconductor assembly, serving the electronics and semiconductor industries worldwide. The company's comprehensive product lineup includes various die attach systems, such as solutions for single-chip, multi-chip, multi-module, flip-chip, thermal compression bonding, fan-out wafer-level packaging, hybrid and embedded bridge die bonding, and die sorting. Additionally, BESI offers a range of packaging equipment, comprising conventional, ultra-thin, and wafer-level molding systems, as well as trim and form, and singulation systems. Its offerings also feature plating equipment for tin, copper, precious metals, and solar applications, along with related process chemicals. Complementing these are tooling, conversion kits, spare parts, and diverse support services. Key brands under its portfolio include Datacon, Esec, Fico, and Meco. The company's customer base primarily comprises multinational chip manufacturers, outsourced assembly and test (OSAT) providers, and industrial and electronics companies. Established in 1995, BESI is headquartered in Duiven, the Netherlands.
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Richard W. Blickman